Samsung Electronics signs MOU with AMD to explore foundry partnership

格隆汇 March 18｜Samsung Electronics and AMD announced on Wednesday that they have signed a memorandum of understanding to expand their strategic partnership in supplying memory chips for artificial intelligence infrastructure. The agreement will focus on providing Samsung's next-generation HBM4 for AMD's upcoming Instinct MI455X AI accelerator, as well as optimized DDR5 memory for AMD's sixth-generation EPYC processors. The two companies will also discuss opportunities for wafer foundry collaboration, under which Samsung could provide contract chip manufacturing services for AMD's next-generation products. According to the agreement, Samsung will become a key HBM4 supplier for AMD's next-generation GPUs.