Samsung Electronics develops next-generation HBM packaging technology, which may be used in smartphones and other mobile devices

Golden Finance May 15｜According to ETNews, Samsung Electronics is developing next-generation HBM packaging technology aimed at delivering high-performance device-side AI for mobile devices such as smartphones and tablets. The technology, called "multi-layer stacked FOWLP," combines ultra-high aspect ratio copper pillars with fan-out wafer-level packaging (FOWLP) and improves upon existing vertical copper pillar stacking (VCS) technology. While server-grade HBM already features high bandwidth, mobile devices face stricter constraints regarding size, thickness, power consumption, and heat dissipation.