Driven by a surge in wafer foundry orders and internal engineering workforce pressures, Samsung Electronics is considering outsourcing the back-end design business of Google's 2nm Tensor Processing Unit (TPU) I/O Die to external partners. Multiple industry sources revealed that Samsung has recently approached its Design Solution Partners (DSPs) to inquire about their interest in taking on the back-end design business for Google's 10th generation TPU I/O Die. This TPU, codenamed "Icefish," will

Driven by a surge in wafer foundry orders and internal engineering workforce pressures, Samsung Electronics is considering outsourcing the back-end design business of Google's 2nm Tensor Processing Unit (TPU) I/O Die to external partners. Multiple industry sources revealed that Samsung has recently approached its Design Solution Partners (DSPs) to inquire about their interest in taking on the back-end design business for Google's 10th generation TPU I/O Die. This TPU, codenamed "Icefish," will

智通财经2026/07/16 17:01

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Due to the surge in wafer foundry orders and internal engineering manpower pressure, Samsung Electronics is considering outsourcing the backend design of Google’s 2nm Tensor Processing Unit (TPU) Input/Output die (I/ODie) to external partners. Multiple industry insiders revealed that Samsung recently approached its Design Solution Partners (DSP) to inquire about their intention to undertake the backend design business for Google’s tenth-generation TPU Input/Output die. This TPU, code-named "Icefish," will be manufactured using Samsung’s 2nm process technology.

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