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AI Computing Power War Spreads to "Advanced Packaging": NVIDIA (NVDA.US) Invests $1.5 Billion in Amkor Technology (AMKR.US), Partners to Expand Arizona Packaging and Testing Plant

AI Computing Power War Spreads to "Advanced Packaging": NVIDIA (NVDA.US) Invests $1.5 Billion in Amkor Technology (AMKR.US), Partners to Expand Arizona Packaging and Testing Plant

智通财经智通财经2026/07/24 00:31
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By:智通财经

Nvidia (NVDA.US) has signed a $1.5 billion agreement with Amkor Technology (AMKR.US) to help strengthen the latter's chip packaging plant.

According to Zhihui Finance APP, Nvidia (NVDA.US) has signed a $1.5 billion agreement with Amkor Technology (AMKR.US) aimed at bolstering the latter’s chip packaging factory—part of a broader initiative to expand semiconductor operations in the United States.

According to a statement released on Thursday, the deal includes an advance payment from Nvidia, which will help Amkor enhance its manufacturing capabilities in Arizona. The news sent Amkor’s stock soaring around 15% in after-hours trading.

The two companies stated that the collaboration will focus on chip packaging and testing technologies within the field of artificial intelligence. Packaging is a crucial final step in semiconductor manufacturing, during which chips are encased so that they can connect with other components.

The companies also said that the Arizona plant will complement Amkor’s production in Asia, creating “a geographically diverse and resilient global supply chain.” Amkor, headquartered in Tempe, Arizona, is a leading global provider of chip packaging and testing services.

As the world’s most valuable company by market capitalization, Nvidia is leveraging its resources to expand the AI computing industry, with this deal being one of many Nvidia has recently entered into. Nvidia is the largest manufacturer of AI accelerators, which are highly valuable core components used for developing and running AI software.

As the semiconductor industry strives to keep pace with explosive demand, advanced packaging for components like accelerator chips has become a supply bottleneck. These products increasingly require the use of special materials and technologies to connect to high-end computers entering data centers.

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