SK Hynix expands DDR4 and DDR5 packaging outsourcing, resumes cooperation with Winpac

SK Hynix is expanding the outsourcing scale of storage semiconductor flip chip packaging. Following OSAT (Outsourced Semiconductor Assembly and Test) supplier A-PROTECH, SK Hynix has begun to outsource more business to WINPAC, marking the first collaboration between the two companies in four years. SK Hynix plans to transfer some DDR4 and DDR5 DRAM memory chip packaging orders to Winpac. Winpac has completed equipment debugging and other production line preparations at its P Plant, and mass production has now commenced. This plant is responsible for packaging high-performance products such as DRAM, NAND flash, and eUFS embedded Universal Flash Storage. Its monthly production capacity has increased from 44 million to 50 million units.