AI computing power demand overwhelms advanced packaging capacity! TSMC (TSM.US) reportedly plans to raise prices by 10-20%, putting cost pressure on Nvidia and Apple.

According to Golden Ten Data APP, supply chain sources report that TSMC (TSM.US) is preparing to raise the prices of its advanced packaging technology by 10%–20%, due to surging demand for AI chips squeezing production capacity. If this plan is implemented, chip manufacturers such as NVIDIA (NVDA.US) and AMD (AMD.US) will face increased costs. Apple’s (AAPL.US) iPhone and MacBook may also be subject to another round of price hikes—both product lines have already seen price increases previously due to higher memory chip prices.