SK Hynix is introducing advanced packaging technologies, including Intel EMIB, for its next-generation HBM solutions and plans to eventually move into the era of 3D packaging. At the 2026 Hot Chips conference, SK Hynix’s Vice President of Packaging Engineering, Jaesik Lee, delivered a report titled "Advanced Packaging of High Bandwidth Memory," detailing how the company will leverage advanced packaging technologies to accelerate its HBM product roadmap. Currently, SK Hynix is exploring methods

SK Hynix is introducing advanced packaging technologies, including Intel EMIB, into its next-generation HBM solutions, and plans to eventually enter the era of 3D packaging. At the 2026 Hot Chips conference, SK Hynix Vice President of Packaging Engineering Jaesik Lee delivered a report titled "Advanced Packaging for High Bandwidth Memory," detailing how the company will accelerate its HBM product roadmap by leveraging advanced packaging technologies. Currently, SK Hynix is exploring methods such as Hybrid Bonding to break through the limit of 16-layer stacking. In the future, SK Hynix also plans to address power consumption challenges by increasing the number of TSVs, improving IO speed of logic process integration, and optimizing the power distribution network (PDN).